Optoelectronic semiconductor devices and processes for the manufacture of optoelectronic semiconductor devices

摘要

In one version, the optoelectronic semiconductor device (1) has a substrate (2) with a first main page (21) and a second main page (22). A majority of light-emitting semiconductor chips (3) are both on the first page (21) and auch on the second main page (22). A mould mass (4) encloses the light emitting semiconductor chips (3) in a lateral direction. The mould mass (4) is levelled with the light emitting semiconductor chips (3) in a direction turned away from the substrate (2)the mould mass (4) has a surface turned away from the substrate (2) (40). On the upper side (40) there are several flat electrical connections (5),which electrically connect the light-emitting semiconductor chips (3) to their radiation outlets (30) turned off by the substrate (2).