Semiconductor multi-imposed substrate members, semiconductor multi-imposed substrates, and semiconductor members

摘要

PROBLEM TO BE SOLVED: To provide a member for a semiconductor multi-imposition substrate capable of obtaining a semiconductor multi-imposition substrate capable of suppressing peeling in a release layer at the time of cutting. A member for a semiconductor multi-sided substrate for forming a semiconductor multi-sided substrate that can be divided into a plurality of semiconductor members by cutting, and is arranged on one main surface side of a glass base material and the glass base material. The peeling layer and the wiring layer arranged on the main surface of the peeling layer opposite to the glass substrate are provided, and the above-mentioned at the time of cutting when the semiconductor multi-imposition substrate is cut into a plurality of semiconductor members. Provided is a semiconductor multi-imposition substrate member, characterized in that the release layer is not arranged on a cutting line of a glass substrate. [Selection diagram] Fig. 1