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HIGH DENSITY AND FINE PITCH INTERCONNECT STRUCTURES IN AN ELECTRIC TEST APPARATUS
HIGH DENSITY AND FINE PITCH INTERCONNECT STRUCTURES IN AN ELECTRIC TEST APPARATUS
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机译:电动试验装置中的高密度和细间距互连结构
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摘要
An electrical-test apparatus is provided, which includes a MEMS array. In an example, the MEMS array comprises a plurality of tester interconnect structures cantilevered from first terminals on a first side of a substrate. The tester interconnect structures may have a first diameter. In an example, the MEMS array comprises a plurality of through-substrate vias that extend through the substrate, the vias having a second diameter larger than the first diameter. In an example, individual ones of the vias electrically couple individual ones of the tester interconnect structures to corresponding ones of second terminals on a second side of the substrate.
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