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Substrate for temperature compensated surface acoustic wave device or bulk acoustic wave device

机译:用于温度补偿表面声波装置或散装声波装置的基板

摘要

A substrate for a surface acoustic wave device or bulk acoustic wave device, comprising a support substrate and an piezoelectric layer on the support substrate, wherein the support substrate comprises a semiconductor layer on a stiffening substrate having a coefficient of thermal expansion that is closer to the coefficient of thermal expansion of the material of the piezoelectric layer than that of silicon, the semiconductor layer being arranged between the piezoelectric layer and the stiffening substrate.
机译:用于表面声波装置或块状声波装置的基板,包括支撑基板上的支撑基板和压电层,其中支撑基板在加强基板上包括半导体层,其具有更靠近的热膨胀系数压电层材料的热膨胀系数比硅的材料,半导体层布置在压电层和加强基板之间。

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