Substrates for temperature compensated surface acoustic wave devices or bulk acoustic wave devices

摘要

Substrates for temperature compensated surface acoustic wave devices or bulk acoustic wave devices. The present invention is a substrate (1) for a surface acoustic wave device or a bulk acoustic wave device comprising a support substrate (11) and a piezoelectric layer (10) on the support substrate, wherein the support substrate (11) And the semiconductor layer (111) on the reinforcing substrate (110), the thermal expansion coefficient of the reinforcing substrate is closer to the thermal expansion coefficient of the material of the piezoelectric layer (10) than the material of silicon, and the semiconductor layer (111) The substrate (1) is characterized in that it is arranged between a piezoelectric layer (10) and a reinforcing substrate (110).