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Semiconductor plug protected by a protective dielectric layer in a three-dimensional memory device and a method for forming a three-dimensional memory device

机译:半导体插头受三维存储器件中的保护介电层保护和形成三维存储器件的方法

摘要

An embodiment of a 3D memory device having a semiconductor plug protected by a dielectric layer and a method for forming a 3D memory device are disclosed. In one example, a 3D memory device includes a substrate, a memory stack including a plurality of interleaved conductor and dielectric layers on the substrate, and a memory string extending vertically through the memory stack. The memory string includes a semiconductor plug underneath the memory string, a protective dielectric layer on the semiconductor plug, and a memory film formed over the protective dielectric layer and along sidewalls of the memory string.
机译:公开了具有由介电层保护的半导体插头的3D存储器件的实施例及其用于形成3D存储器件的方法。在一个示例中,3D存储器件包括基板,存储器堆叠,存储器堆叠在基板上包括多个交织导体和介电层,以及通过存储器堆叠垂直延伸的存储器串。存储器串包括在存储器串下方的半导体插头,半导体插头上的保护介电层,以及在保护介质层上形成的存储膜以及沿着存储器串的侧壁形成。

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