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INNOVATIVE FAN-OUT PANEL LEVEL PACKAGE (FOPLP) WARPAGE CONTROL
INNOVATIVE FAN-OUT PANEL LEVEL PACKAGE (FOPLP) WARPAGE CONTROL
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机译:创新的扇出面板级包装(FOPLP)翘曲控制
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摘要
Fan-out panel level packages (FOPLPs) comprising warpage control structures and techniques of formation are described. An FOPLP may comprise one or more redistribution layers; a semiconductor die on the one or more redistribution layers; one or more warpage control structures adjacently located next to the semiconductor die; and a mold compound encapsulating the semiconductor die and the one or more warpage control structures on the one or more redistribution layers. The FOPLP can be coupled a board (e.g., a printed circuit board, etc.). The warpage control structures can assist with minimizing or eliminating unwanted warpage, which can occur during or after formation of an FOPLP or a packaged system. In this way, the warpage control structures can assist with reducing costs associated with semiconductor packaging and/or manufacturing of an FOPLP or a packaged system.
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