SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER AND SOLDER JOINT

摘要

A solder material capable of suppressing the occurrence of electromigration is provided.The solder material is core ball 1A which comprises spherical core 2A composed of Cu or a Cu alloy, and solder layer 3A coating core 2A, and wherein solder layer 3A has:a Cu content of 0.1 mass% or more and 3.0 mass% or less,a Bi content of 0.5 mass% or more and 5.0 mass% or less,a Ag content of 0 mass% or more and 4.5 mass% or less, anda Ni content of 0 mass% or more and 0.1 mass% or less,with Sn being the balance.