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SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER, SOLDER JOINT, AND METHOD FOR CONTROLLING SOLDER MATERIAL
SOLDER MATERIAL, SOLDER PASTE, FOAM SOLDER, SOLDER JOINT, AND METHOD FOR CONTROLLING SOLDER MATERIAL
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机译:焊锡材料,焊锡膏,泡沫焊锡,焊点以及焊锡材料的控制方法
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摘要
Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ball 1A is provided with a Cu ball 2A for keeping a space between a semiconductor package and a printed circuit board and a solder layer 3A that covers the Cu ball 2A. The solder layer 3A is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ball 1A, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.
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机译:提供一种在熔融焊料时或熔融之后具有抗氧化性并且在熔融焊料之前将氧化膜的厚度控制在固定值或更小的焊料材料。 Cu芯球1A设置有用于保持半导体封装件和印刷电路板之间的空间的Cu球2A以及覆盖Cu球2A的焊料层3A。焊料层3A由Sn或主要成分为Sn的焊料合金构成。对于Cu芯球1A,在L * a * b *颜色空间中的亮度等于或大于65,并且在L * a * b *颜色空间中的黄色等于或小于7.0,并且更优选地,亮度等于或大于70,并且其黄色等于或小于5.1。
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