Process for the electrolytic deposition shiny tin - lower impacts

• 1. 沉积锡合金的电解质介质和沉积锡合金的方法 [P] . 中国专利： CN100487168C . 2009.05.13
• 2. 沉积锡合金的电解质介质和沉积锡合金的方法 [P] . 中国专利： CN1524136A . 2004-08-25
• 3. Process for the electrolytic deposition shiny nickel lower impacts from galvanic baths [P] . 德国专利： DE944038C . 1956-06-07

  机译： 电解沉积过程中电镀镍对电镀镍的影响较小

• 4. Process for the electrolytic deposition shiny metal lower impacts [P] . 德国专利： DE925560C . 1955-03-24

  机译： 工艺对电解沉积有光泽的金属影响较小

• 5. Process for the electrolytic deposition shiny lower impacts from cyanidic kupferbaedern [P] . 德国专利： DE895686C . 1953-11-05

  机译： 氰化kupferbaedern对电解沉积产生较低光泽影响的方法

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