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Metallization process without current of the body not - conductors, as well as body in accordance with those obtained by said method, or similar.

机译:没有主体的电流的无金属化过程不是导体,以及根据所述方法获得的导体,或类似方法。

摘要

1,164,459. Coating with metals. DEUTSCHE GOLD-UND SILBER-SCHEIDEANSTALT. Nov.11, 1966 [Nov.12, 1965], No.50754/66. Heading C7F. In the electroless plating of a non-conductor e.g. PVC, polyethylene,polypropylene, cellulose hydrate or rubber with e. g. Cu, Ni or Cr, from 10 to 50% by weight of a filler is worked into the non-conductor before plating, the filler, e. g. silicas with Si-H bonds, metal oxides or alkali- or alkaline earth metal silicates or aluminosilicates, is such as will combine with a plating catalyst e. g. Pd or Ag, either before or after mixing with the non-conductor. The non-conductor may be applied to a metal, e. g. Fe or Al, substrate and the electroless coating may be subsequently electroplated. In an example silica with 6% silanol is worked into polythene, the formed resin is dipped in sulphuric acid, rinsed, immersed in an ammoniacal solution or Pd C1 2 and then plated.
机译:1,164,459。用金属涂层。德意志金UND-SILBER-SCHEIDEANSTALT。 1966年11月11日(1965年11月12日),编号50754/66。标题C7F。在非导体的化学镀中PVC,聚乙烯,聚丙烯,水合纤维素或橡胶,例如G。在电镀之前,将按重量计10%至5​​0%的填料的Cu,Ni或Cr加工成非导体。 G。具有Si-H键的二氧化硅,金属氧化物或碱金属或碱土金属的硅酸盐或铝硅酸盐例如将与电镀催化剂结合。 G。与非导体混合之前或之后的Pd或Ag。所述非导体可以被施加到金属,例如金属。 G。随后可以电镀Fe或Al,基材和化学镀层。在一个实例中,将具有6%硅烷醇的二氧化硅加工成聚乙烯,将形成的树脂浸入硫酸中,冲洗,浸入氨溶液或Pd Cl 2中,然后镀覆。

著录项

  • 公开/公告号FR1496278A

    专利类型

  • 公开/公告日1967-09-29

    原文格式PDF

  • 申请/专利号FR19660079206

  • 发明设计人

    申请日1966-10-07

  • 分类号C23C18/16;C23C18/20;

  • 国家 FR

  • 入库时间 2022-08-23 13:58:32

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