improvement of warmwalzbarkeit leaded copper alloys

• 1. 含铅的铜合金的降低铅溶出的处理方法及含铅的铜合金制的水管道用器具 [P] . 中国专利： CN1678768A . 2005-10-05
• 2. 带筒状部的含铅铜合金电镀制品的除铅方法与水阀金属件以及含铅铜合金制品铅浸出防止方法与水阀金属件 [P] . 中国专利： CN1473209A . 2004-02-04
• 3. IMPROVEMENTS IN OR RELATING TO THE RECOVERY OF COPPER FROM COPPER/LEAD ALLOYS [P] . 英国专利： GB2197880B . 1991-02-20

  机译： 从铜/铅合金中回收铜或与之相关的改进

• 4. Improvements to the processes of the coatings of the copper or copper alloys with lead [P] . 法国专利： FR1011811A . 1952-06-27

  机译： 改善铜或铜合金铅涂层的工艺

• 5. Improvements in or relating to the coating of iron, steel, copper and copper alloy with lead [P] . 英国专利： GB657025A . 1951-09-05

  机译： 改善或涉及铁，钢，铜和铜合金的铅涂层

• 1. Simulation of aging process of lead frame copper alloy by an artificial neural network [J] . 苏娟华, 董企铭, 刘平, 中国有色金属学报（英文版） . 2003,第006期
• 2. Electroless Plating Lead and Lead-Tin on Copper Using an Eco-Friendly Plating Bath [J] . A. B. Abdel-Aziz, M. M. B. El-Sabbah, I. M. Ghayad, 材料科学与应用期刊（英文） . 2020,第012期
• 3. Lead isotopic composition and lead source of the Tongchanghe basalt-type native copper-chalcocite deposit in Ninglang, western Yunnan, China [J] . 张乾, 朱笑青, 张正伟 中国地球化学学报：英文版 . 2006,第002期
• 4. Lead isotopic systematics for native copper-chalcocite mineralization in basaltic lavas of the Emeishan large igneous province, SW China:Implications for the source of copper [J] . ZHANG Qian, WANG Dapeng, ZHU Xiaoqing, 中国地球化学学报（英文版） . 2009,第001期
• 5. INTERFACIAL TENSIONS OF SOLID COPPER/LIQUID LEAD AND SOLID COPPER/LIQUID BISMUTH [J] . 刘友鹏, 陶为民, 吴申庆 东南大学学报：英文版 . 1991,第001期
• 6. Characterization of the corrosion structures of roman copper alloys by SEM and EDSX IMMACO: Improvement of means of measurements on Archaeoogical copper alloys for characterization and conservation [C] . alexandra Dorigo, Christinan Fiaud, Jean-Pierre labbe, METAL 98 . 1998
• 7. Wetting kinetics and interfacial reaction of lead-based and lead-free solder alloys on copper and nickel metallizations in electronic packaging. [D] . Kim, Harqkyun. 1996
• 8. Proteomic and genetic analysis of S. cerevisiae response to soluble copper leads to improvement of antimicrobial function of cellulosic copper nanoparticles [O] . Xiaoqing Rong-Mullins, Matthew J. Winans, Justin B. Lee, -1
• 9. Improvement of Adhesion Strength Between Epoxy Resin and Copper Alloy Lead-frame with Silver Layer Electrodeposited from Acid Aqueous Solution [O] . 大貝 猛, 高尾 慶蔵, 木下 慎也, 2011

• 1. 含铅玻璃中化学成分分析方法的改进 [C] . 梁金凤 ,杨占菊 ,隆英兰 . 中国矿山“三率”管理与技术装备创新年会 . 2015
• 2. 铜合金自形成阻挡层及其性能改进研究 [A] . 曹菲 . 2016