process for galvanic gold plating and solutions to your application

• 1. 一种不锈钢电镀金及其加工工艺和应用 [P] . 中国专利： CN111270278B . 2022.01.25
• 2. 一种不锈钢电镀金及其加工工艺和应用 [P] . 中国专利： CN111270278A . 2020-06-12
• 3. process for galvanic gold plating and solutions to your application [P] . 德国专利： DE2317028A1 . 1973-11-08

  机译： 电镀金工艺及您的应用解决方案

• 4. GOLD-STRIKE PLATING METHOD CORRESPONDING TO PRETREATMENT PROCESS FOR ELECTROLESS PALLADIUM PLATING ON COPPER SURFACE OF PRINTED CIRCUIT BOARD COMPOSITION OF GOLD-STRIKE PLATING SOLUTION AND ELECTROLESS PLATING METHOD OF PALLADIUM AND GOLD [P] . 韩国专利： KR102041850B1 . 2019-11-06

  机译： 对应于在无铅电镀溶液组成的印刷电路板的铜表面上的无电镀钯的预处理工艺的镀金方法和钯金的化学镀方法

• 5. Non-cyanide electroless gold plating solution and process for electroless gold plating [P] . 美国专利： US7384458B2 . 2008-06-10

  机译： 非氰化物化学镀金溶液及化学镀金方法

• 1. APPLICATION OF COAL GOLD AGGLOMERATION PROCESS TO GOLD RECOVERING FROM AMALGAMATION TAILINGS [J] . 中国有色金属学会会刊：英文版 . 1997,第004期
• 2. Ore—Forming Conditions and the Process of Gold Mineralization of Wendeng Gold Deposit,Shandong—Application of Cathodo—Luminescence in Fluid Inclusion Studies [J] . 赖勇 中国地球化学学报：英文版 . 1995,第002期
• 3. SUPERGENE GEOCHEMICAL PROCESSES OF GOLD AND ITS APPLICATIONS IN PROSPECTING IN THE MAOPAI AREA,JIANGXI PROVINCE,CHINA [J] . Zhangweimin, ShiWeijunandZhouWenbin 大地构造与成矿学：英文版 . 1996,第0Z1期
• 4. The Application of Synthetic Fuzzy Assessing Method in Measurement and Control System of Plating Solution Evaporator [J] . 周晓兵, 费敏锐, 陈维刚 东华大学学报（英文版） . 2004,第003期
• 5. Feasibility Studies of Cyanide-Free Gold Plating Solutions For Electronic Connector Plating Applications [C] . Rob Schetty National Association for Surface Finishing Annual Conference and Trade Show . 2014
• 6. The structure and composition of an electroplated gold-tin solder alloy co-deposited by pulse plating from solutions containing ethylendiamine as a stabilizer [D] . Doesburg, Jacobus Cornelis 2000
• 7. Rational molecular design for realizing high performance sky-blue-emitting gold(iii) complexes with monoaryl auxiliary ligands and their applications for both solution-processable and vacuum-deposited organic light-emitting devices [O] . Man-Chung Tang, Wing-Kei Kwok, Shiu-Lun Lai, 2019
• 8. Gold plating of critical components for space applications: Challenges and solutions [O] . Indira Rajagopal, K. S. Rajam, S. R. Rajagopalan 2011
• 9. Comparison Assay of a Gold Plating Solution by Controlled-Potential Coulometry and Fire Assay [R] . Harrar, J. E., Waggoner, M. C., Loy, J. W. 1980

• 1. Optical Properties of Solution-Processed MEH-PPV Thin Films for Optoelectronic Applications [J] . Nazir Mustapha ,Zakia Fekkai . 材料科学与工程：中英文A版 . 2011,第002期
• 2. DMH无氰光亮电镀金工艺研究 [C] . REN Xue-feng ,任雪峰 ,AN Mao-zhong . 中国电子学会电子制造与封装技术分会电镀专家委员会第十七届学术年会 . 2015
• 3. 电镀金刚石线锯参数化表征与晶体切片工艺研究 [A] . 张晨政 . 2021