A manufacturing method for high-strength connections between non-magnetic metal foils, and bodies on epoxide - base

摘要

In a process of firmly bonding together a foil of a paramagnetic metal (except pure Cu) with a pref. plane article based on epoxy resin, the metal foils are bonded to the plane epoxy-based articles with interposition of foils of uncured epoxy material and with application of pressure and heat, the surface of the metal foil which is to be bonded being coated with a layer of Cu and/or a layer of evenly distributed Cu(I)-oxide. A firm bond between laminae is achieved. Process is applicable in mfr. of printed circuits.