METALIZATION PROCESS FOR THE MANUFACTURE OF HYBRID INTEGRATED CIRCUITS

摘要

1387089 Printed circuits BENDIX CORP 18 Sept 1973 [2 Oct 1972] 43730/73 Heading H1R A printed circuit board is manufactured by depositing, e.g. by sputtering, a layer 11 of nickel-chromium on a substrate, then a layer 12 of nickel, e.g. by sputtering, then a layer 14 of nickel-boron, e.g. by electroless plating and then optionally a plated gold layer 13, and the assembly is heat treated to anneal and stabilize the resistive nickel-chromium layer. A pattern of resistive and/or conductive tracks is produced by masking and etching techniques. The presence of the nickel-boron layer is stated to permit low-temperature solder connections or ultrasonic wire bonding to be made, and so the assembly requires a shorter heat-treatment time. Assembly instructions or the like may be marked on the board by depositing a further layer of nickel-boron and masking and etching to leave the desired marking. Semi-conductor devices for mounting on the board advantageously have their connection regions coated, like the board, with successive layers of nickelchromium nickel, nickel-boron and optionally gold.