首页> 外国专利> Dissolving copper from substrates - by oxidising copper to cuprous ions using cupric ions

Dissolving copper from substrates - by oxidising copper to cuprous ions using cupric ions

机译:从基材溶解铜-通过使用铜离子将铜氧化为亚铜离子

摘要

Process for dissolving copper from a substrate by a) oxidising the copper with cupric ions to form cuprous ions, the cupric ions are provided by a regenerative alkaline corrosive soln contg. cupric ions, ammonium hydroxide, a copper complexing agent chosen from an ammonium salt and a chelating agent, the ammonium complexing agent always being present. b) continuously oxidising cuprous to cupric ions. c) determining the copper ion concn. to ascertain when the copper ion concn has reached a previously determined max. d) removing a certain amt. of the alkaline corrosive soln in response to c) to lower the copper ion concn in the range indicated e) adding neutral/alkaline ammoniacal soln comprising ammonium salt/hydroxide and a chelating agent. The ammonium salt always being added. The addn should be sufficient to replace the ammonium slats/hydroxides and the chelating agents removed at d).
机译:通过以下步骤从衬底上溶解铜的方法:a)用铜离子氧化铜以形成亚铜离子,该铜离子由可再生的碱性腐蚀性溶液提供。铜离子,氢氧化铵,选自铵盐的铜络合剂和螯合剂,该铵络合剂始终存在。 b)不断地将亚铜氧化为铜离子。 c)确定铜离子浓度。确定何时铜离子浓度已达到预先确定的最大值。 d)删除特定的amt。响应于c)降低碱金属腐蚀性溶液的铜离子浓度,使其在指定的范围内e)添加包含铵盐/氢氧化物和螯合剂的中性/碱性氨水溶液。总是添加铵盐。该添加物应足以代替在d)处除去的铵盐板条/氢氧化物和螯合剂。

著录项

  • 公开/公告号FR2174816B1

    专利类型

  • 公开/公告日1974-10-25

    原文格式PDF

  • 申请/专利权人 SOUTHERN CALIFORNIA CHEMUS;

    申请/专利号FR19720028554

  • 发明设计人

    申请日1972-08-08

  • 分类号C23F1/00;H05K3/00;

  • 国家 FR

  • 入库时间 2022-08-23 05:16:09

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