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SEMICONDUCTOR CHIP TO SUBSTRATE SOLDER BOND USING A LOCALLY DISPERSED, TERNARY INTERMETALLIC COMPOUND
SEMICONDUCTOR CHIP TO SUBSTRATE SOLDER BOND USING A LOCALLY DISPERSED, TERNARY INTERMETALLIC COMPOUND
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机译:使用局部分散的三元金属间化合物来替代焊锡的半导体芯片
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摘要
A solder bond between a semiconductor chip and a substrate is improved by the addition of a region of solder which is dispersion hardened with a ternary intermetallic. In the preferred embodiment the solder is constituted by a solid solution of tin in lead and a uniformly dispersed copper/tin/palladium ternary intermetallic. One of the constituents of the ternary intermetallic is a constituent of the solder.
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