SEMICONDUCTOR CHIP TO SUBSTRATE SOLDER BOND USING A LOCALLY DISPERSED, TERNARY INTERMETALLIC COMPOUND

摘要

A solder bond between a semiconductor chip and a substrate is improved by the addition of a region of solder which is dispersion hardened with a ternary intermetallic. In the preferred embodiment the solder is constituted by a solid solution of tin in lead and a uniformly dispersed copper/tin/palladium ternary intermetallic. One of the constituents of the ternary intermetallic is a constituent of the solder.