首页> 外国专利> Printed circuits mfr by electroless metal-deposn - of conductors on insulating substrate whose surface is pre-treated by corona discharge

Printed circuits mfr by electroless metal-deposn - of conductors on insulating substrate whose surface is pre-treated by corona discharge

机译:通过化学沉积对导体表面进行电晕放电处理的绝缘基板上的导体进行的印制电路

摘要

A printed circuit is mfd. by electroless metal deposition of the conductor lines on a pre-treated insulated substrate whose surface has been treated, before the metallising step, by corona discharge. Adhesion of metal conductor lines to substrate is considerably improved. The claimed process is simpler than prior-art methods using a surface-oxidising agent e.g. chromic acid for the pre-treatment of the substrate. The homogeneity of the surface is not affected. The insulating substrate may be coated with a hardenable synthetic resin. Polyurethane is a suitable resin.
机译:印刷电路板是mfd。通过在前处理的绝缘基板上化学镀金属以沉积导线,该绝缘基板的表面在金属化步骤之前已通过电晕放电处理过。金属导体线对基板的粘附性得到了显着改善。所要求保护的方法比使用表面氧化剂(例如表面活性剂)的现有技术方法更简单。铬酸用于底物的预处理。表面的均匀性不受影响。绝缘基板可以涂覆有可硬化的合成树脂。聚氨酯是合适的树脂。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号