Thin-layer chip capacitor - has insulating substrate, dielectric film on base electrode and nickel contact surfaces

摘要

The thin layer chip capacitor consists of an insulating substrate, a base aluminium electrode, a dielectric deposited on the base electrode, an aluminium counter-electrode and solderable terminal contact areas on both electrodes, these areas being of nickel. This type of capacitor affords mass production by selecting the substrate of suitable size. Instead of conventional layer combination only one layer is used and the expensive gold used in conventional capacitors of this type is replaced by nickel. The replacement of the chromium-nickel-gold combination permits better utilisation of existing surfaces, since nickel does not produce with aluminium a harmful alloy.