Chip module with a dielectric substrate and at least one chip accommodated in a substrate cavity is provided with several electrodes which are shaped so that they almost completely cover the cavity base surface

摘要

The chip module (1) with a dielectric substrate (2) and at least one chip (4) accommodated in a substrate cavity (5) is provided with several electrodes (3) which are shaped in such a way that they almost completely cover the cavity base surface. An Independent claim is also included for a method for producing such a chip module.