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Affordable Fabrication of Conductive Electrodes and Dielectric Films for a Paper-Based Digital Microfluidic Chip

机译:基于纸的数字微流控芯片的导电电极和介电膜的可负担的制造

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摘要

In order to fabricate a digital microfluidic (DMF) chip, which requires a patterned array of electrodes coated with a dielectric film, we explored two simple methods: Ballpoint pen printing to generate the electrodes, and wrapping of a dielectric plastic film to coat the electrodes. For precise and programmable printing of the patterned electrodes, we used a digital plotter with a ballpoint pen filled with a silver nanoparticle (AgNP) ink. Instead of using conventional material deposition methods, such as chemical vapor deposition, printing, and spin coating, for fabricating the thin dielectric layer, we used a simple method in which we prepared a thin dielectric layer using pre-made linear, low-density polyethylene (LLDPE) plastic (17-μm thick) by simple wrapping. We then sealed it tightly with thin silicone oil layers so that it could be used as a DMF chip. Such a treated dielectric layer showed good electrowetting performance for a sessile drop without contact angle hysteresis under an applied voltage of less than 170 V. By using this straightforward fabrication method, we quickly and affordably fabricated a paper-based DMF chip and demonstrated the digital electrofluidic actuation and manipulation of drops.
机译:为了制造数字微流体(DMF)芯片,该芯片需要图案化的阵列电极涂有介电膜,我们探索了两种简单的方法:圆珠笔印刷以生成电极,以及包裹介电塑料膜以覆盖电极。为了精确且可编程地打印带图案的电极,我们使用了带有圆珠笔的数字绘图仪,该笔装有银纳米粒子(AgNP)墨水。代替使用传统的材料沉积方法(例如化学气相沉积,印刷和旋涂)来制造薄介电层,我们使用一种简单的方法,在该方法中,我们使用预制的线性低密度聚乙烯制备了薄介电层(LLDPE)塑料(厚度为17-μm),只需简单包装即可。然后,我们用薄薄的硅油层将其密封,从而可以用作DMF芯片。这样处理过的介电层在低于170 V的施加电压下,对于无接触滴的无固着滴表现出良好的电润湿性能。通过使用这种简单的制造方法,我们快速而经济地制造了纸基DMF芯片,并演示了数字电流体技术液滴的驱动和操纵。

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