基于Ag-PDMS复合导电材料的微流控芯片3D电极的制备

摘要

提出一种利用Ag粉和聚二甲基硅氧烷(Polydimethylsiloxane,PDMS)制成的复合材料加工微流控芯片3D电极的方法.选取导电性良好的银粉作为填料物,透明性良好和生物兼容的PDMS作为基体.将Ag颗粒表面改性后,用超声法、机械共混法相结合的方法与P DMS混合加工形成一种新型Ag-P DMS复合导电材料.分析了Ag粉的形貌、粒径、填料比例与复合材料电阻率的关系,结果表明当选取粒径为1μm片状Ag颗粒作为填料物,填料质量分数为86%时,Ag-PDMS复合导电材料的导电性能最好.最后利用软光刻方法,经过曝光、显影、填充、固化和剥离等过程,制备了3D电极.实验证明,该方法可以成功制备Ag-PDMS复合导电材料微流控芯片3D电极,对微流控芯片电极的制备有重要意义.%The 3D electrodes in microfluidic chip were prepared by using the composite material mixed with Ag powder and PDMS.Ag powder with good conductive properties selected as filler and PDMS with excellent transparency and biological compati-bility selected as the substrate were mixed to form a new Ag-PDMS conductive compound.The material was processed via utilizing the method of ultrasonic and mechanical blending. The relationships between resistivity and the shape, size of silver particles, packing ratio were analyzed.The results show that Ag-PDMS composite conductive material conductive performance is best when packing ratio is 86 wt% and when the particle size is 1μm.3D electrodes were fabricated by using soft lithography including the processes of exposure,development,filling,solidification,and stripping.Experiments verify the feasibility of 3D electrodes that was made of Ag-PDMS conductive compound which has important significance for the preparation of electrodes in microfluidic chip.