Refinements introduced into ceramic capacitors comprising a plurality of superimposed dielectric layers and metal layers, said layers being of dense sintered ceramic material and being integrally joined in a plurality of edge portions thereof, and at least one of said metal layers being intercalated between an adjacent pair of said layers, the metal of said sandwich layer having a lower melting point than the maximum temperature used in the sintering of said ceramic dielectric material, and electrical connections to said metal layers. (Machine-translation by Google Translate, not legally binding)
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