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Electrolytic regeneration of spent etchant - contg. iron and copper chloride(s), esp. from printed circuit boards mfr. to avoid pollution and increase etching power

机译:废蚀刻剂的电解再生-续铁和氯化铜,特别是从印刷电路板制造避免污染并增加蚀刻能力

摘要

Spent etching solns. contg. chloride ions are regenerated by electrochemical oxidn., in which copper is deposited at the cathode, and chlorine is evolved at the anode; and the Cl2 is used for regenerating the soln. pref. the soln. is fed in counter current to the evolved Cl2 and to the anode at min. 1.5 times the linear speed at which the soln. is fed to the cathode; and the spent soln. pref. contains (a) CuCl2; or (b) FeCl2 and CuCl2. Specific spent soln. contains 0.7-1.4 mole/l FeCl3, 0.9-1.5 mole/l CuCl2, 1.1-2.0 mole/l alkali metal chloride, 0.2-0.8 mole/l HCl, with water to 1l. Electrolysis of soln. (a) is pref. at 15-80, esp. 25-40 A/dm2; and at 8-35, esp. 15-20 A/dm2 for solns. (b); in all cases, regeneration is pref. at 10-40 degrees C.
机译:废蚀刻液。续氯离子通过电化学氧化再生,其中铜沉积在阴极,而氯释放在阳极。 Cl2用于再生soln。偏好soln。在最小电流下,将其以逆流的形式馈送到放出的Cl2和阳极。锡线速度的1.5倍。送入阴极;和用过的Soln。偏好含有(a)CuCl2;或(b)FeCl2和CuCl2。专用废液。含有0.7-1.4摩尔/升的FeCl3、0.9-1.5摩尔/升的CuCl2、1.1-2.0摩尔/升的碱金属氯化物,0.2-0.8摩尔/升的HCl,用水稀释至1升。电解电解。 (a)是偏好。在15-80,尤其是25-40 A / dm2;而在8-35,尤其是solns为15-20 A / dm2。 (b);在所有情况下,再生都是首选。在10-40摄氏度。

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