PLATING METHOD OF TIN OR TIN ALLOY TO ENHANCE SEALABILITY AND SOLDERABILITY ON NICKEL COBALT * IRON ALLOY

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• 2. 铜-锡合金镀膜、非氰系铜-锡合金镀液以及采用该镀液的镀覆方法 [P] . 中国专利： CN101649474B . 2011.07.20
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  机译： 电沉积金属镍，铁或钴的镍，钴或二元或三元合金的方法，以及用于实施该方法的电镀液

• 4. METHOD FOR electrodeposition NICKEL, COBALT or binary or ternary alloys OF METALS THAT ARE NICKEL, IRON OR COBALT AND plating FOR THE PURSUIT OF PROCEDURE [P] . DK152593B . 1988-03-21

  机译： 电镀镍，钴或镍，铁或钴的金属的二元或三元合金的方法和电镀方法的方法

• 5. Method and a plating bath for the deposition of nickel / iron - and nickel / cobalt / iron - alloys [P] . 德国专利： DE2450133A1 . 1975-05-07

  机译： 沉积镍/铁和镍/钴/铁合金的方法和电镀液

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• 4. THE EFFECTS OF BATH CONDITIONS ON ELECTROLESS NICKEL-IRON ALLOY PLATING FOR UBM APPLICATIONS [C] . Ja-Kyung Koo, Jae-Ho Lee Pan Pacific Microelectronics Symposium . 2015
• 5. Electrodeposition of copper-cobalt alloys and copper-nickel alloys and pulse plating of copper-cobalt alloys [D] . Wang, Shuisheng. 1989
• 6. Comparative Evaluation of Metal-ceramic Bond Strengths of Nickel Chromium and Cobalt Chromium Alloys on Repeated Castings: An In vitro Study [O] . Kaleswara Rao Atluri, Tapan Teja Vallabhaneni, Durga Prasad Tadi, 2014
• 7. Influence of Basic Component of plating Bath. Tin, Solder and Lead Free Alloy Plating. [O] . Kiyotaka TSUJI 1999
• 8. Effectiveness of nickel plating in inhibiting atmospheric corrosion of copper alloy contacts [R] . Ernest, T. , Sorensen, R. , Guilinger, T. 1997

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• 2. Direct Electroless Nickel Plating on AZ91D Magnesium Alloy from a Sulfate Solution and its Deposition Mechanism [J] . GUChang-dong LIANJian-she LIGuang-yu NIULi-yuan JIANGZhong-hao . 材料热处理学报 . 2004,第05B期
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