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Method for electrodeposition of nickel, cobalt, or binary or ternary alloys of the metals nickel, iron or cobalt, as well as the plating solution for practicing the method

机译:电沉积金属镍,铁或钴的镍,钴或二元或三元合金的方法,以及用于实施该方法的电镀液

摘要

ADDITIVE FOR IMPROVED ELECTROPLATING PROCESS This invention relates to a process and composition for the preparation of an electro-deposit which contains; at least one metal selected from the group consisting of nickel and cobalt or; binary or ternary alloys of the metals selected from nickel, iron, and coba which comprises passing current from an anode to a cathode through an aqueous acidic electroplating solution containing at least one member selected from nickel compounds and cobalt compounds and which may additionally contain iron compounds providing nickel, cobalt and iron ions for electrodepositing nickel, cobalt, nickelcobalt alloys, nickel-iron alloys, cobalt-iron alloys or nickel-iron-cobalt alloys; the improvement comprising the presence of 5 x 10-6 moles per liter to 0.5 mole per liter of an unsaturated cyclosulfone exhibiting the following generalized structural formula: wherein R1, R2, R3 and R4 are independently hydrogen, lower alkyl, or hydroxyl; for a time period sufficient to form a metal electroplate upon said cathode.
机译:本发明涉及一种制备电沉积物的方法和组合物,该电沉积物包含:选自镍和钴的至少一种金属,或选自镍,铁和钴的金属的二元或三元合金;其包括使电流从阳极流过阴极的水溶液通过酸性电镀液,该溶液至少包含一种选自镍化合物和钴化合物的元素,并且还可以包含提供镍,钴和铁离子的铁化合物,用于电沉积镍,钴,镍钴合金,镍铁合金,钴铁合金或镍铁钴合金;所述改进包括存在5×10-6摩尔/升至0.5摩尔/升的不饱和环砜,所述不饱和环砜具有以下通式的结构式:其中R 1,R 2,R 3和R 4独立地为氢,低级烷基或羟基;足以在所述阴极上形成金属电镀的时间。

著录项

  • 公开/公告号DK152593C

    专利类型

  • 公开/公告日1988-09-05

    原文格式PDF

  • 申请/专利权人 M&T CHEMICALS INC.;

    申请/专利号DK19770004370

  • 发明设计人 HARBULAK EDWARD PAUL;

    申请日1977-10-03

  • 分类号C25D3/18;C25D3/56;

  • 国家 DK

  • 入库时间 2022-08-22 07:00:39

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