首页> 外国专利> A method for producing multilayer sintered glass ceramic substrates, with of gold, silver or copper, and said wiring substrates produced thereby

A method for producing multilayer sintered glass ceramic substrates, with of gold, silver or copper, and said wiring substrates produced thereby

机译:用金,银或铜制造多层烧结玻璃陶瓷衬底的方法,以及由此生产的所述布线衬底

摘要

Sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of highly conductive metals such as gold, silver or copper are provided which can be fired in air (for gold and silver) or in neutral atmospheres (for copper) at temperatures below the melting points of these metals. This has been made possible by the discovery that finely divided powders of certain glasses described herein sinter to essentially zero porosity at temperatures below 1000° C. while simultaneously maturing to glass-ceramics of low dielectric constant, high flexural strength and low thermal expansivity.
机译:提供了包含高导电金属(如金,银或铜)的多层互连厚膜电路图案的烧结玻璃陶瓷基板,可在空气中(对于金和银)或在中性气氛(对于铜)中于温度低于这些金属的熔点。通过发现,本文所述的某些玻璃的细分粉末在低于1000℃的温度下烧结至基本为零孔隙率,同时成熟为低介电常数,高挠曲强度和低热膨胀率的玻璃陶瓷,使得这成为可能。

著录项

  • 公开/公告号DE2901172A1

    专利类型

  • 公开/公告日1979-08-16

    原文格式PDF

  • 申请/专利权人 IBM;

    申请/专利号DE19792901172

  • 申请日1979-01-13

  • 分类号C03C3/22;C03B32/00;

  • 国家 DE

  • 入库时间 2022-08-22 19:42:56

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