METHOD OF AND APPARATUS FOR TAKING, TRANSFERRING AND ASSEMBLING OF SMALL ELEMENTS, ESPECIALLY SEMICONDUCTOR CHIPS

• 1. LED芯片转移用感光性转移树脂、利用该感光性转移树脂的LED芯片转移方法及利用其的显示装置的制造方法 [P] . 中国专利： CN113906547A . 2022-01-07
• 2. 芯片转移基板、芯片转移装置和芯片转移方法 [P] . 中国专利： CN113257979A . 2021-08-13
• 3. METHOD OF AND APPARATUS FOR TAKING, TRANSFERRING AND ASSEMBLING OF SMALL ELEMENTS, ESPECIALLY SEMICONDUCTOR CHIPS [P] . PL122243B1 . 1982-07-31

  机译： 微量元素特别是半导体芯片的摄取，转移和组装的方法和装置

• 4. METHOD FOR ASSEMBLING SEMICONDUCTOR CHIPS AND DEVICE FOR TRANSFERRING SEMICONDUCTOR CHIPS [P] . 世界知识产权组织专利： WO2018033248A3 . 2018-05-03

  机译： 组装半导体芯片的方法和用于传输半导体芯片的装置

• 5. METHOD FOR ASSEMBLING SEMICONDUCTOR CHIPS AND DEVICE FOR TRANSFERRING SEMICONDUCTOR CHIPS [P] . 世界知识产权组织专利： WO2018033248A2 . 2018-02-22

  机译： 组装半导体芯片的方法和用于传输半导体芯片的装置

• 1. IMPLICIT-EXPLICIT MULTISTEP FINITE ELEMENT-MIXED FINITE ELEMENT METHODS FOR THE TRANSIENT BEHAVIOR OF A SEMICONDUCTOR DEVICE [J] . 陈蔚 数学物理学报（英文版） . 2003,第003期
• 2. Design of Microscope Apparatus with Matrix CCD for Inspecting Semiconductor Chips [C] . Yu Houyun, Deng Shanxi Instrumentation Science and Technology Vol.2 . 2002
• 3. Methodologies for broadband electromagnetic modeling of on-chip semiconductor substrate noise. [D] . Manetas, George. 2009
• 4. Bacteria Inside Semiconductors as Potential Sensor Elements: Biochip Progress [O] . Vasu R. Sah, Robert E. Baier 2014
• 5. Bacteria Inside Semiconductors as Potential Sensor Elements: Biochip Progress [O] . Vasu R. Sah, Robert E. Baier 2014
• 6. Apparatus and Methods for Cooling Semiconductor Integrated Circuit Chip Packages. [R] . Andry, P. S., Colgan, E. G. 2006

• 1. Method and Apparatus for Creating Problem-Solving Complexes from Individual Elements [J] . Bernhard Mitterauer . 生命科学与技术进展（英文） . 2014,第4期
• 2. New IC package, assembly technique by means of a "blind" alignment "flip-chip" method and assembling facilities [J] . Vladimir V. Novikov . 电子与封装 . 2004,第004期
• 3. FINITE ELEMENT ANALYSIS FOR CHIP FORMATION IN HIGH SPEED TURNING OPERATIONS BY ARBITRARY LAGRANGIAN EULERIAN METHOD [J] . USAMA Umer ,XIE Lijing ,WANG Xibin . 中国机械工程学报 . 2006,第004期
• 4. Analysis of Unsteady Heat Transfer Problems with Complex Geometries Using Isogeometric Boundary Element Method [J] . Weihua Fang ,Zhilin An ,Tiantang Yu . 计算机、材料和连续体(英文) . 2020,第2期
• 5. 适用于硅铝丝超声键合半导体芯片微组装的以铜代金薄膜工艺研究 [C] . 张忠文 . 第八届全国混合集成电路学术会议 . 1994
• 6. ALICE ITS像素传感器芯片组装中的定位方法的研究 [A] . 朱严 . 2016