METHOD OF AND APPARATUS FOR TAKING, TRANSFERRING AND ASSEMBLING OF SMALL ELEMENTS, ESPECIALLY SEMICONDUCTOR CHIPS

• 1. LED芯片转移用感光性转移树脂、利用该感光性转移树脂的LED芯片转移方法及利用其的显示装置的制造方法 [P] . 中国专利： CN113906547A . 2022-01-07
• 2. 芯片转移基板、芯片转移装置和芯片转移方法 [P] . 中国专利： CN113257979A . 2021-08-13
• 3. METHOD OF AND APPARATUS FOR TAKING, TRANSFERRING AND ASSEMBLING OF SMALL ELEMENTS, ESPECIALLY SEMICONDUCTOR CHIPS [P] . PL207825A1 . 1980-03-10

  机译： 微量元素特别是半导体芯片的摄取，转移和组装的方法和装置

• 4. METHOD FOR ASSEMBLING SEMICONDUCTOR CHIPS AND DEVICE FOR TRANSFERRING SEMICONDUCTOR CHIPS [P] . 世界知识产权组织专利： WO2018033248A3 . 2018-05-03

  机译： 组装半导体芯片的方法和用于传输半导体芯片的装置

• 5. METHOD FOR ASSEMBLING SEMICONDUCTOR CHIPS AND DEVICE FOR TRANSFERRING SEMICONDUCTOR CHIPS [P] . 世界知识产权组织专利： WO2018033248A2 . 2018-02-22

  机译： 组装半导体芯片的方法和用于传输半导体芯片的装置

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• 4. Bacteria Inside Semiconductors as Potential Sensor Elements: Biochip Progress [O] . Vasu R. Sah, Robert E. Baier 2014
• 5. Bacteria Inside Semiconductors as Potential Sensor Elements: Biochip Progress [O] . Vasu R. Sah, Robert E. Baier 2014
• 6. Apparatus and Methods for Cooling Semiconductor Integrated Circuit Chip Packages. [R] . Andry, P. S., Colgan, E. G. 2006

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• 3. FINITE ELEMENT ANALYSIS FOR CHIP FORMATION IN HIGH SPEED TURNING OPERATIONS BY ARBITRARY LAGRANGIAN EULERIAN METHOD [J] . USAMA Umer ,XIE Lijing ,WANG Xibin . 中国机械工程学报 . 2006,第004期
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