device for stacking and entstapeln of plate

• 1. 用于堆叠板热交换器的堆叠板及堆叠板热交换器 [P] . 中国专利： CN110418932B . 2021.06.18
• 2. 用于堆叠板热交换器的堆叠板及堆叠板热交换器 [P] . 中国专利： CN110418932A . 2019-11-05
• 3. device for stacking and entstapeln of plates [P] . 德国专利： DE3533752C2 . 1988-07-28

  机译： 板的堆叠和固定装置

• 4. device for stacking and entstapeln of plate [P] . 德国专利： DE2649952C2 . 1983-11-17

  机译： 板的堆叠和固定装置

• 5. device for stacking and entstapeln of plate [P] . ATA521277A . 1979-07-15

  机译： 板的堆叠和固定装置

• 1. Study on Welding-Bead Bonding Strength of Laser-Stacking Copper-Aluminum Heterogeneous Electrode Plates [J] . Shang-Wu Tsai, Shih-Kai Chien, Kun-Tso Chen, 机械工程与自动化：英文版 . 2021,第005期
• 2. Design of New Elevator Pressure Guide Plate and Its Test Device [J] . Qihang Xu, Shaoke Chen 机械工程(英文) . 2019,第001期
• 3. Development of multiple GaAs plate-stacked quasi-phase-matching mid-infrared wavelength-conversion devices by use of room-temperature bonding [C] . Hiroki Atarashi, Terumitsu Kubota, Ichiro Shoji Conference on Lasers and Electro-Optics Europe;European Quantum Electronics Conference . 2017
• 4. Nanomembrane stacked electronic and optoelectronic devices and strained channel flexible high-speed transistors [D] . Zhou, Han 2011
• 5. Optimization of Structure and Electrical Characteristics for Four-Layer Vertically-Stacked Horizontal Gate-All-Around Si Nanosheets Devices [O] . Qingzhu Zhang, Jie Gu, Renren Xu, 2021
• 6. ANALYSIS OF HEAT PROPAGATION PROCESSES IN STRUCTERS OF PULSE POWERFUL DEVICES NEAR PLANES OF SOLDER OF SILICON PLATES IN HIGH VOLTAGE STACKS [O] . A. L. Glazov, V. A. Kozlov, O. Korolkov, 2015
• 7. Effects on Ferroelectric Thin-Film Stacks and Devices for Piezoelectric MEMS Applications at Varied Total Ionizing Dose (TID). [R] . Rivas, M., Brewer, S. J., Callaway, C., 2017

• 1. Dependence of Plasma Parameters on Plate Separation and Filament Location in a Double Plasma Device [J] . Monojit Chakraborty ,Bidyut Kumar Das ,Mrinal Kumar Mishra . 现代物理（英文） . 2012,第9期
• 2. FEA technique of hot plate forming process using cell-typed die with cooling device [J] . Jung-Min LEE ,In-Kyu LEE ,Kyung-Hun LEE . 中国有色金属学会会刊：英文版 . 2012,第S3期
• 3. Analog Devices公司 Devices EVAL—ADICUP360开发板 [J] . . 现代制造 . 2016,第016期
• 4. SMTA华南高科技技术研讨会论文下一代元件堆叠技术(收缩式的元件堆叠) [C] . 吉姆阿卓思 ,约翰阿穆伦斯 ,纪鹏 . 2014中国高端SMT学术会议 . 2014
• 5. 基于分布式交换机IRF堆叠的板间通信研究与实现 [A] . 朱奇 . 2016