AIR-COOLED SEMICONDUCTOR ARRANGEMENT WITH DISC-SHAPED SEMICONDUCTOR COMPONENTS CLAMPED BETWEEN RADIATOR BODIES

摘要

In a semiconductor arrangement, a disc-shaped semiconductor component (17) is clamped dust-tight in each case between two heat sinks (7, 8, 20). A frame (5) inserted in a bearing rack is used as the insulating part which carries the heat sinks (7, 8, 20). The frame (5) has two side-by-side window-like openings (23), which are surrounded on both sides by a groove (30) which carries a seal (15, 16), and a semiconductor component (17) is arranged in at least one of the openings (23). Vertically to the plane of the openings (23), the frame (5) has a front plate (22) and a rear plate (21), which, with the insulating plates of the bearing rack, form an air duct which encloses the heat sinks (7, 8, 20). The semiconductor arrangement can be used advantageously in power converter cabinets on electric railway rolling stock. IMAGE