Light installation semiconductor component manufacture technique having inner semiconductor component outer thermal radiator inserted and wiring connection position clamped using outer body mouth section deformation.

摘要

The semiconductor component manufacture technique has an outer thermal radiator section (12) into which the component (1) surrounded by an isolating electrical sleeve (11) is inserted. The protruding wire (1C) is clamped into position by a tool (20) which permanently deforms the shape of the box (126) at the component exit mouth.