首页> 外国专利> METHOD OF FABRICATING A DIODE BRIDGE RECTIFIER IN MONOLITHIC INTEGRATED CIRCUIT STRUCTURE

METHOD OF FABRICATING A DIODE BRIDGE RECTIFIER IN MONOLITHIC INTEGRATED CIRCUIT STRUCTURE

机译:在整体集成电路结构中制造二极管桥式整流器的方法

摘要

D-22641ABSTRACT OF THE DISCLOSUREMethod of fabricating monolithic integrated circuitstructure incorporating a full-wave diode bridge rectifierof four Schottky diodes. A body of silicon is produced bygrowing an epitaxial layer of N-type silicon on a P-typesubstrate. P-type imparting material is diffused into thelayer to form isolating barriers delineating first andsecond N-type zones separated from each other by inter-vening P-type material and third and fourth N-type zoneswhich are contiguous. A mixture of titanium and tungstenis deposited on portions of the zones and heated to forma mixed silicide. Schottky rectifying barriers are pro-duced at the interfaces of the mixed silicide and N-typezones. Conductive members are formed; a first conductivemember is connected to the N-type material of the firstzone and the silicide of the third zone, a second conduc-tive member is connected to the N-type material of thesecond zone and the silicide of the fourth zone, a thirdconductive member is connected in common to the silicideof the first and second zones, and a fourth conductivemember is connected to the N-type material of the thirdand fourth zones. An AC voltage applied across the firstand second conductive members produces a DC voltage acrossthe third and fourth conductive members.
机译:D-22641披露摘要制作单片集成电路的方法包含全波二极管桥式整流器的结构四个肖特基二极管。硅体是由在P型上生长N型硅的外延层基质。 P型赋予材料扩散到层形成隔离栅,首先描述第二个N型区域之间相互隔开静脉P型材料以及第三和第四N型区域这是连续的。钛和钨的混合物沉积在部分区域上并加热形成混合硅化物。肖特基整流壁垒在混合硅化物和N型的界面处产生区域。形成导电构件;第一导电构件连接到第一个的N型材料区和第三区的硅化物元件连接到N型材料的第二区和第四区的硅化物,第三区导电构件与硅化物共同连接第一和第二区域,以及第四导电构件连接到第三种的N型材料和第四区。第一次施加交流电压第二导电部件在两端产生DC电压第三和第四导电构件。

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