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METHOD OF MANUFACTURING A SILICON WAFER WITH INTERIOR MICRODEFECTS CAPABLE OF GETTERING
METHOD OF MANUFACTURING A SILICON WAFER WITH INTERIOR MICRODEFECTS CAPABLE OF GETTERING
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机译:具有可吸收的内部微缺陷的硅晶片的制造方法
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摘要
A semiconductor wafer is first heat treated in a non-oxidising atmosphere in a temperature in the range from 950 DEG C to 1300 DEG C to diffuse out oxygen (O2) from near the surfaces 1 and 2 of the wafer (oxygen density shown by broken line in Figure 3B). The wafer is then heat treated at a temperature in the range from 600 DEG C to 800 DEG C to create a high density of defects 3 (defect density shown by solid lines in Figures 3B and 3D) which are capable of gettering, in the interior of the wafer.
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