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Silicon gigabits per second metal-oxide-semiconductor device processing.
Silicon gigabits per second metal-oxide-semiconductor device processing.
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机译:硅千兆字节每秒对金属氧化物半导体器件的处理。
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摘要
In a metal-oxide-semiconductor device process, parasitic capacitance is significantly recued by producing a spacer of insulating material (e.g., 41, 42) on a gate mesa (e.g., 22) and exposed portions of a substrate (e.g., 14 and 15), by differentially oxidizing a substrate and a gate mesa thereon prior to ion implantation and "drive-in" of the drain and source regions (e.g., 13 and 11, repectively, and 12). This results in a channel region being formed in the substrate beneath and substantially coextensive with the gate mesa. The conductivity of the channel region is different from the conductivity of the adjacent source and drain regions. In one embodiment, the source and drain regions each extend to a greater depth into the substrate with increasing distance from the channel region.
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