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Laser-enhanced jet-plating and jet-etching: high-speed maskless patterning method
Laser-enhanced jet-plating and jet-etching: high-speed maskless patterning method
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机译:激光增强的喷镀和蚀刻:高速无掩模构图方法
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摘要
This metal deposition/material removal technique modifies free- standing or submerged jet plating with an electromagnetic energy beam such as an intense laser beam, directed collinearly along the jet. Experiments were made to deposit gold contact areas on nickel plated beryllium-copper substrates used for microelectronic connectors. The deposits are found to be crack-free and dense, possessing excellent adhesion to the substrate. Deposition rates for 0.05 cm diameter gold spots are on the order of 10 micrometers per second.
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