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Copper plating bath having increased plating rate, and method
Copper plating bath having increased plating rate, and method
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机译:具有增加的镀覆速度的铜镀覆浴和方法
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摘要
A copper plating bath containing a sulfur-containing anion other than sulfate anion and/or a selenium-containing anion other than a selenate anion and/or a tellurium-containing anion other than a tellurate anion in an amount sufficient to increase the plating rate, and method for electroplating copper onto a substrate with the plating bath.
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