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arrangement for measuring electrical resistance and temperature of nanoseconds or aufstaeuben on isolated thin metallic substrates during the schichtherstellung conductive layers.
arrangement for measuring electrical resistance and temperature of nanoseconds or aufstaeuben on isolated thin metallic substrates during the schichtherstellung conductive layers.
A system for measuring electrical resistance and temperature during the manufacture of thin, conductive films deposited on substrates by means of evaporation or sputter-deposition. A deposition unit with an evacuatable load lock chamber and a rotating substrate holder are employed as the deposition system. The specific electrical resistance of the film is measured according to the principle of the two-point or four-point measuring methods at a reference substrate with specific sample geometry and with low-resistance contacts. The substrate temperature is measured by means of resistance thermometers. With the invention, the transmission of the measured data occurs contact-free by means of electro-magnetic radiation, preferably by means of a telemetric pulse code modulation method.
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