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Multilayer substrate comprising a thin wiring structure for circuits with large-scale integration or very-large-scale integration
Multilayer substrate comprising a thin wiring structure for circuits with large-scale integration or very-large-scale integration
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机译:包含用于大规模集成或超大规模集成的电路的薄布线结构的多层基板
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摘要
The substrate of the present invention comprises: an insulated substrate 11; a first conducting metal layer 12 formed on the substrate; an insulated organic layer 13 including interconnection holes which connect the upper and lower conducting metal layers, the organic layer being formed on the conducting metal layer; a low-temperature sintered metal 14A or a conducting organic paste embedded in the holes connecting the upper and lower conducting metal layers; and a second metal layer 15 formed on the insulated organic layer and the low-temperature sintered metal or the conducting organic paste. IMAGE
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