Multilayer substrate comprising a fine structure of the wiring for circuits has a large scale integration or a very large scale integration

摘要

The substrate of the present invention comprises: an insulated substrate 11; a first conducting metal layer 12 formed on the substrate; an insulated organic layer 13 including interconnection holes which connect the upper and lower conducting metal layers, the organic layer being formed on the conducting metal layer; a low-temperature sintered metal 14A or a conducting organic paste embedded in the holes connecting the upper and lower conducting metal layers; and a second metal layer 15 formed on the insulated organic layer and the low-temperature sintered metal or the conducting organic paste. IMAGE