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Lead frame coated with aluminum as a packaging material in integrated circuits
Lead frame coated with aluminum as a packaging material in integrated circuits
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机译:引线框涂有铝作为集成电路中的包装材料
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摘要
The present invention relates to an improvement of a packaging material for use in integrated circuits (IC) such as IC, LSI and VLSI, and in particular to an improvement of a lead frame made of iron-nickel alloys used as a material in a low-melting-point glass-ceramic package. The invention resides in provision of a lead frame faces made of an iron- nickel alloy substrate containing nickel therein at a ratio of 42 to 49% by weight and the improvement wherein an aluminium layer of 0.2 to 10 microns thick is coated on both faces and sides of the substrate.
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