packaged integrated circuit lead frame and circuit mounting structure for packaging an integrated circuit

摘要

The invention PWB (printed from the high-speed route that leads on the bottom of the high-speed signal integrated circuit packaging relates to a wiring board) or other type of packaging an integrated circuit, which is installed on a circuit mounting structure. The packaged integrated circuit package comprises a body portion formed from a sealing material (encapsulant) which surrounds the die to the die, at least in part. Further, the lead frame (leadframe) is connected to the die, at least in part enclosed within ssainda package body. Leads extending from the package body, a subset of these leads are separated by a pitch (lead-to-lead pitch) between the leads. At least two adjacent leads of the lead frame are separated by a large space than pitch. In addition, and more lead is connected to the die, is disposed on the bottom (underside) of the package. The additional lead may be connected to a circuit mounting structure extending between adjacent lead traces separated by a space wider than the pitch (circuit mounting structure trace).