High power RF thick film resistor and method for the manufacture thereof

摘要

An improved thick film resistor is disclosed which is comprised of a substrate, a resistor body comprised of a plurality of overlying layers of a resistor material, and a pair of spaced apart terminals each of which has a primary contact portion and a plurality of spaced apart secondary contact portions. The secondary contact portions are interleaved between the layers of resistor material and extend partially into the resistor body and are in electrical and heat transferring contact with the respective primary contact portions of each terminal. The novel thick film resistor is compact in its dimensions and is capable of dissipating substantially large amounts of heat and providing lower current densities than conventional thick film resistors.