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ADDITIVE FOR ACID ELECTROLYTIC COPPER PLATING BATH, MANUFACTURE AND APPLICATION TO PRINT CIRCUIT COPPER PLATING
ADDITIVE FOR ACID ELECTROLYTIC COPPER PLATING BATH, MANUFACTURE AND APPLICATION TO PRINT CIRCUIT COPPER PLATING
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机译:酸性电解铜镀液的添加剂,制造方法及其在印刷电路镀铜中的应用
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摘要
Additive composition for an acid copper electroplating bath, which bath being well adapted for the copper plating of printed circuits, is comprised of (1) the sodium salt of omega -sulfo-n-propyl N,N-diethyldithiocarbamate, (2) polyethylene glycol having an average molecular weight ranging from about 6,000 to 20,000, (3) crystal violet, and (4) sulfuric acid.
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