PROCESS FOR FABRICATING DIMENSIONALLY STABLE INTERCONNECT BOARDS AND PRODUCT PRODUCED THEREBY

摘要

A method of manufacturing hybrid circuit boards consisting of depositing a conductive structure (12) on an insulating substrate (10) and then baking on the surface of the latter a strip-shaped layer (14) of glass ceramic. This strip-shaped layer (14) provides both electrical insulation and electrical connections between the substrate (10) and the electrical conductors or electronic components which are subsequently connected to the top surface of the shaped layer glass ceramic strip (14) or mounted thereon. The passage of electrical conductors in interconnections of the strip-shaped layer (14) before the baking of said layer (14) directly on the substrate (10) makes it possible to maintain good lateral orthogonal dimensional stability of the strip material. In addition, a thick glass ceramic film of high quality electrical insulation is obtained for a relatively low manufacturing cost.