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process for obtaining passive circuits in thin layer with resistive lines to different resistance layer and circuit board produced with the process, the passive

机译:获得具有电阻线的薄层中的无源电路的方法以及到该方法生产的电路板的电阻层

摘要

On a single insulating substrate (1) there are deposited in succession a thin layer of tantalium (2) with high resistivity doped with nitrogen and oxygen, a less thin layer of titanium (3) with low resistivity doped with nitrogen, a layer of palladium (4) and a thick layer of gold (7). Selective chemical attacks of said layers then permit tracing of conducting lines (7), resistive lines with greater resistance (10) and resistive lines with less resistance (13).
机译:在单个绝缘基板(1)上依次淀积一层高电阻率的氮和氧掺杂的钽薄层(2),一层低电阻率的氮掺杂的低电阻率的钛薄层(3)和一层钯(4)和厚厚的一层金(7)。所述层的选择性化学侵蚀然后允许追踪导线(7),具有较大电阻的电阻线(10)和具有较小电阻的电阻线(13)。

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