AUTOMATIC WAFER ALIGNMENT METHOD, METHOD FOR DETERMINING THE LOCATION OF EDGES AND WAFER ALIGNMENT SYSTEM

• 1. 对准晶片的方法、接合晶片的方法以及对准晶片的装置 [P] . 中国专利： CN111048459A . 2020-04-21
• 2. 晶片预对准器及预对准晶片的方法 [P] . 中国专利： CN112466802A . 2021-03-09
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  机译： 自动晶片对准方法，确定边缘位置的方法和晶片对准系统

• 4. Automatic wafer alignment method, method for determining the location of edges and wafer alignment system [P] . 欧洲知识产权局专利： EP0079070B1 . 1986-10-29

  机译： 自动晶片对准方法，确定边缘位置的方法和晶片对准系统

• 5. AUTOMATIC WAFER ALIGNMENT METHOD, METHOD FOR DETERMINING THE LOCATION OF EDGES AND WAFER ALIGNMENT SYSTEM [P] . 德国专利： DE3274021D1 . 1986-12-04

  机译： 自动晶片对准方法，确定边缘位置的方法和晶片对准系统

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