method for the manufacture of a metallmuster isoliersubstrates marked, especially printed circuit boards, full additive technology

摘要

Catalytically imaged thermosetting and thermoplastic resin objects including printed circuit boards are provided. A hydrophilic, adhesion promoted insulating base material is treated in selected areas to produce metallic nuclei in the form of an image of a desired metal pattern. The image is exposed to an electroless metal bath to reinforce the image. Then, the non-imaged areas of the base are rendered hydrophobic by means of solvent treatment. The imaged areas are built up by metal deposition. Preferably, the solvent treatment of the non-imaged areas of the base material is repeated to enhance adhesion of the metal pattern to the base material.