Manufacturing Methods and Technology for Digital Fault Isolation of Printed Circuit Boards

摘要

This report presents the final recommendations and conclusions, with supporting data, resulting from the contract option phase of contract DAAK40-78-C-0290. It describes the manufacturing technology and test system that will enable detection, identification, and location of digital faults in the advanced missile electronic systems that will be used in the 1980's. Emphasis is placed on the fault diagnosis of large printed circuit boards containing complex hybrid digital microelectronic circuits. The Basic Effort included an industry survey for digital printed circuit board test requirements and available test system capabilities, the D/PCB testability investigation and resulting design guide, the development of digital fault isolation methodology and the comprehensive selection of the optimum ATE that recommended the DTS-70 system. The contract option phase of this project involved the purchase and installation of the DTS-70 system, the selection of the PN-1635972 and the PN-1646178 D/PCBs for testing, the development of generalized test software and the development of the specific hardware and software needed to test these worst-case boards. (Author)